US 12,265,334 B2
Optical proximity correction and photomasks
Dong-Yo Jheng, Hsinchu (TW); Ken-Hsien Hsieh, Taipei (TW); Shih-Ming Chang, Hsinchu (TW); Chih-Jie Lee, Hsinchu (TW); Shuo-Yen Chou, Hualien County (TW); and Ru-Gun Liu, Hsinchu County (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu (TW)
Filed on Jul. 30, 2023, as Appl. No. 18/361,879.
Application 18/361,879 is a continuation of application No. 17/665,757, filed on Feb. 7, 2022, granted, now 11,789,370.
Application 17/665,757 is a continuation of application No. 16/895,547, filed on Jun. 8, 2020, granted, now 11,243,472, issued on Feb. 8, 2022.
Application 16/895,547 is a continuation of application No. 16/057,277, filed on Aug. 7, 2018, granted, now 10,678,142, issued on Jun. 9, 2020.
Claims priority of provisional application 62/585,914, filed on Nov. 14, 2017.
Prior Publication US 2023/0384691 A1, Nov. 30, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G03F 1/36 (2012.01); G03F 7/00 (2006.01)
CPC G03F 7/70441 (2013.01) [G03F 1/36 (2013.01); G03F 7/705 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
receiving a layout for fabricating a mask;
determining a plurality of target contours corresponding to a plurality of sets of lithographic process conditions, wherein at least two of the plurality of target contours are different;
determining a modification to the layout;
simulating the modification to the layout under the plurality of sets of lithographic process conditions to produce a plurality of simulated contours;
determining a cost of the modification to the layout based on comparisons between the plurality of simulated contours and corresponding ones in the plurality of target contours; and
providing the modification to the layout for fabricating the mask based at least in part on the cost being within a predetermined threshold.