US 12,265,252 B2
Resonant device improvement in PICs using spare devices to reduce power requirements
Michael Y. Frankel, Bethesda, MD (US); Vladimir Pelekhaty, Baltimore, MD (US); and Sadok Aouini, Gatineau (CA)
Assigned to Ciena Corporation, Hanover, MD (US)
Filed by Ciena Corporation, Hanover, MD (US)
Filed on Sep. 1, 2021, as Appl. No. 17/463,865.
Claims priority of provisional application 63/074,801, filed on Sep. 4, 2020.
Prior Publication US 2022/0075114 A1, Mar. 10, 2022
Int. Cl. G02B 6/12 (2006.01); G02B 6/293 (2006.01); G02F 1/01 (2006.01)
CPC G02B 6/12007 (2013.01) [G02B 6/29343 (2013.01); G02B 6/29382 (2013.01); G02B 6/29395 (2013.01); G02F 1/0147 (2013.01); G02F 2203/15 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A Photonic Integrated Circuit (PIC) comprising:
N Ring and Disk type Microstructures (RDMs), N is an integer and greater than 1;
at least one spare RDM, wherein each RDM operates spectrally in a periodic nature and has its spectral operation vary by temperature, wherein the N RDMs and the at least one spare RDMs are drop filters for a receiver; and
circuitry configured to handoff, in-service and hitless for an associated channel in the handoff, any of the N RDMs and the at least one spare RDM for spectral operation based on a current temperature, wherein, for the handoff, a cascading tuning is performed wherein the at least one spare RDM is unlocked spectrally and electro-optically or thermo-optically tuned and locked to a frequency of interest of a current RDM based on the temperature, and the current RDM is unlocked, wherein the circuitry configured to handoff includes a selectable photocurrent summation circuit that sums currents of any two RDMs being in the handoff for in-service operation.