US 12,265,140 B2
Magnetic sensor and its manufacturing method
Yuichiro Yamaji, Tokyo (JP); Osamu Harakawa, Binan (PH); and Makoto Kameno, Binan (PH)
Assigned to TDK Corporation, Tokyo (JP)
Appl. No. 18/040,554
Filed by TDK Corporation, Tokyo (JP)
PCT Filed Aug. 3, 2021, PCT No. PCT/JP2021/028804
§ 371(c)(1), (2) Date Feb. 3, 2023,
PCT Pub. No. WO2022/030502, PCT Pub. Date Feb. 10, 2022.
Claims priority of application No. 2020-135062 (JP), filed on Aug. 7, 2020.
Prior Publication US 2023/0296700 A1, Sep. 21, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G01R 33/09 (2006.01); G01R 33/00 (2006.01)
CPC G01R 33/093 (2013.01) [G01R 33/0052 (2013.01); G01R 33/091 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A magnetic sensor comprising:
a substrate;
a sensor chip having an element formation surface having a magnetosensitive element formed thereon and mounted on a surface of the substrate such that the element formation surface is perpendicular to the surface of the substrate; and
a magnetism collecting member mounted on the surface of the substrate such that a first surface thereof faces the surface of the substrate and a second surface thereof faces the element formation surface of the sensor chip,
wherein an arithmetic mean waviness Wa of the second surface is 0.1 μm or less,
wherein a flatness of the first and second surfaces of the magnetism collecting member is higher than that of at least one of other surfaces of the magnetism collecting member,
wherein the magnetism collecting member has a third surface,
wherein the sensor chip and magnetism collecting member are fixed to each other through an adhesive applied on the sensor chip and the third surface of the magnetism collecting member, and
wherein the flatness of the first and second surfaces is higher than that of the third surface.