US 12,265,103 B2
Leadless current sensor package with high isolation
Robert A. Briano, Auburn, NH (US); Michael C. Doogue, Bedford, NH (US); and William P. Taylor, Amherst, NH (US)
Assigned to Allegro MicroSystems, LLC, Manchester, NH (US)
Filed by Allegro MicroSystems, LLC, Manchester, NH (US)
Filed on Aug. 5, 2022, as Appl. No. 17/817,796.
Prior Publication US 2024/0044946 A1, Feb. 8, 2024
Int. Cl. G01R 19/00 (2006.01); G01R 15/14 (2006.01); G01R 15/20 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01)
CPC G01R 19/0092 (2013.01) [G01R 15/146 (2013.01); G01R 15/207 (2013.01); H01L 21/4821 (2013.01); H01L 23/4951 (2013.01); H01L 23/49531 (2013.01); H01L 24/45 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 1/189 (2013.01); H05K 3/301 (2013.01); H01L 2224/4502 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/09445 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10636 (2013.01); H05K 2201/10977 (2013.01)] 34 Claims
OG exemplary drawing
 
1. A sensor package comprising:
a lead frame including: (i) a primary conductor, (ii) a plurality of secondary leads, and (iii) a layer of dielectric material that is disposed between the primary conductor and the plurality of secondary leads;
a current sensor die including one or more sensing elements, the current sensor die being configured to measure a level of electrical current through the primary conductor of the lead frame; and
an interposer that is dispose between the current sensor die and the secondary leads, the interposer being spaced apart laterally from the primary conductor and the current sensor die, the interposer being disposed over the layer of dielectric material, the interposer including a substrate and a plurality of conductive traces that are formed on the substrate, the plurality of conductive traces being configured to couple each of a plurality of terminals of the current sensor die to a respective one of the plurality of secondary leads,
wherein: (i) the primary conductor and the current sensor die are disposed in a first end portion of the sensor package, and the current sensor die is disposed over the primary conductor, (ii) the plurality of secondary leads is disposed in a second end portion of the sensor package, and (iii) the interposer is disposed in a middle portion of the sensor package, the middle portion being situated between the first end portion and the second end portion.