US 12,264,981 B2
Pressure sensing device and pressure sensing apparatus
Tuoxia Huang, Guangdong (CN); and Jinbo Yu, Guangdong (CN)
Assigned to SHENZHEN NEW DEGREE TECHNOLOGY CO., LTD., Shenzhen (CN)
Appl. No. 17/912,838
Filed by SHENZHEN NEW DEGREE TECHNOLOGY CO., LTD., Guangdong (CN)
PCT Filed Feb. 8, 2021, PCT No. PCT/CN2021/075916
§ 371(c)(1), (2) Date Sep. 19, 2022,
PCT Pub. No. WO2021/185004, PCT Pub. Date Sep. 23, 2021.
Claims priority of provisional application 63/064,086, filed on Aug. 11, 2020.
Claims priority of provisional application 62/992,000, filed on Mar. 19, 2020.
Prior Publication US 2023/0146214 A1, May 11, 2023
Int. Cl. G01L 1/22 (2006.01); G01L 1/14 (2006.01); G01L 1/18 (2006.01); H01L 29/8605 (2006.01); H01L 49/02 (2006.01); G06F 3/041 (2006.01)
CPC G01L 1/2293 (2013.01) [G01L 1/148 (2013.01); G01L 1/2262 (2013.01); G01L 1/2281 (2013.01); H01L 28/20 (2013.01); H01L 29/8605 (2013.01); G01L 1/18 (2013.01); G06F 3/041 (2013.01); G06F 2203/04105 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A pressure sensing device, comprising:
at least one pressure sensing sheet, and
a first substrate, configured for carrying the at least one pressure sensing sheet;
wherein the pressure sensing sheet is connected with the first substrate by welding, and welding points are configured for transmitting a deformation and transmitting an electrical signal, and the at least one pressure sensing sheet comprises:
a second substrate, provided with an upper surface and a lower surface opposite to the upper surface;
at least one semiconductor film, fixed on the lower surface and/or the upper surface of the second substrate, wherein a signal measurement circuit is integrated in the at least one semiconductor film, and the signal measurement circuit is configured for detecting an amount of the deformation and outputting the electrical signal that is able to be identified; and
a plurality of bonding pads, configured to be welded with the first substrate, wherein the bonding pads are arranged at the upper surface of the second substrate, and are electrically connected to the semiconductor film.