US 12,264,908 B2
Measuring apparatus
Keiji Nomaru, Tokyo (JP)
Assigned to DISCO CORPORATION, Tokyo (JP)
Filed by DISCO CORPORATION, Tokyo (JP)
Filed on Dec. 28, 2022, as Appl. No. 18/147,072.
Claims priority of application No. 2022-001070 (JP), filed on Jan. 6, 2022.
Prior Publication US 2023/0213331 A1, Jul. 6, 2023
Int. Cl. G01B 11/06 (2006.01); G01B 11/03 (2006.01); H01L 21/66 (2006.01)
CPC G01B 11/0608 (2013.01) [G01B 11/03 (2013.01); G01B 11/06 (2013.01); G01B 11/0625 (2013.01); G01B 11/0675 (2013.01); H01L 22/12 (2013.01); G01B 2210/56 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A measuring apparatus for measuring a thickness or a height of a plate-shaped workpiece, the measuring apparatus comprising:
a chuck table that holds the plate-shaped workpiece; and
a measuring unit that measures the thickness or the height of the plate-shaped workpiece held by the chuck table,
wherein the measuring unit includes
a light source that emits light in a predetermined wavelength region,
a condenser lens that applies the light emitted by the light source, to the plate-shaped workpiece held by the chuck table,
a collimating lens that forms return light reflected by the plate-shaped workpiece into parallel light,
a transmission filter that transmits interference light of the return light formed into the parallel light,
a sensor that has coordinates for receiving the interference light transmitted through the transmission filter and detecting light intensity, and
a controller that determines a coordinate position at which the light intensity detected by the sensor is high, as the thickness or the height of the plate-shaped workpiece.