US 12,264,624 B2
Build plate integrated into additive manufactured component
Lawrence A. Binek, Glastonbury, CT (US); and Sean R. Jackson, Palm City, FL (US)
Assigned to RTX Corporation, Farmington, CT (US)
Filed by Raytheon Technologies Corporation, Farmington, CT (US)
Filed on Jun. 10, 2022, as Appl. No. 17/837,691.
Prior Publication US 2023/0399977 A1, Dec. 14, 2023
Int. Cl. B64D 27/14 (2006.01); B22F 5/00 (2006.01); B22F 10/28 (2021.01); B22F 10/66 (2021.01); B33Y 10/00 (2015.01); B33Y 40/20 (2020.01); B33Y 80/00 (2015.01); B64C 1/10 (2006.01); B64D 33/00 (2006.01); F02C 7/04 (2006.01)
CPC F02C 7/04 (2013.01) [B22F 5/009 (2013.01); B22F 10/28 (2021.01); B22F 10/66 (2021.01); B33Y 10/00 (2014.12); B33Y 40/20 (2020.01); B33Y 80/00 (2014.12); B64C 1/10 (2013.01); B64D 27/14 (2013.01); B64D 33/00 (2013.01); F05D 2220/323 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A formation method, comprising:
arranging a build plate within a build space;
building a first object onto the build plate within the build space using an additive manufacturing process, the object fused to the build plate during the additive manufacturing process; and
machining at least the build plate to form a component comprising a portion of the build plate and at least a portion of the first object, the machining comprising removing a bottom portion of the build plate from the build plate to provide a second build plate that is discrete from the component.