US 12,264,406 B2
Plating apparatus and substrate cleaning method
Kentaro Yamamoto, Tokyo (JP); Masaki Tomita, Tokyo (JP); and Kazuhito Tsuji, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Appl. No. 17/802,400
Filed by EBARA CORPORATION, Tokyo (JP)
PCT Filed Nov. 4, 2021, PCT No. PCT/JP2021/040602
§ 371(c)(1), (2) Date Aug. 25, 2022,
PCT Pub. No. WO2023/079634, PCT Pub. Date May 11, 2023.
Prior Publication US 2024/0209538 A1, Jun. 27, 2024
Int. Cl. C25D 21/08 (2006.01); C25D 17/00 (2006.01); C25D 17/02 (2006.01); C25D 17/06 (2006.01)
CPC C25D 17/06 (2013.01) [C25D 17/004 (2013.01); C25D 17/02 (2013.01); C25D 21/08 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A plating apparatus comprising:
a plating tank configured to accommodate a plating solution;
a substrate holder configured to hold a substrate with a surface to be plated facing downward;
an elevating mechanism configured to elevate the substrate holder;
a cover member arranged above the plating tank and having a side wall surrounding an elevating path of the substrate holder;
an opening/closing mechanism configured to open and close an opening formed in the side wall of the cover member;
a substrate cleaning member for discharging a cleaning liquid toward a surface to be plated of a substrate held by the substrate holder; and
a driving mechanism configured to move the substrate cleaning member between a cleaning position between the plating tank and the substrate holder and a retracted position retracted from between the plating tank and the substrate holder, through the opening.