US 12,264,270 B2
Method for producing cured product of heat-curable maleimide resin composition
Yoshihiro Tsutsumi, Annaka (JP)
Assigned to SHIN-ETSU CHEMICAL CO., LTD., Tokyo (JP)
Filed by Shin-Etsu Chemical Co., Ltd., Tokyo (JP)
Filed on Mar. 28, 2023, as Appl. No. 18/127,122.
Claims priority of application No. 2022-071347 (JP), filed on Apr. 25, 2022.
Prior Publication US 2023/0340299 A1, Oct. 26, 2023
Int. Cl. B29C 65/00 (2006.01); B32B 7/12 (2006.01); B32B 9/04 (2006.01); B32B 27/08 (2006.01); B32B 27/36 (2006.01); B32B 37/12 (2006.01); C09J 5/06 (2006.01); C09J 179/08 (2006.01); B29C 65/02 (2006.01); B29C 65/40 (2006.01); B29C 65/48 (2006.01)
CPC C09J 5/06 (2013.01) [B32B 7/12 (2013.01); B32B 9/045 (2013.01); B32B 27/08 (2013.01); B32B 27/36 (2013.01); B32B 37/1207 (2013.01); C09J 179/08 (2013.01); B29C 65/02 (2013.01); B29C 65/405 (2013.01); B29C 65/4835 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2307/7376 (2023.05); C09J 2479/08 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A method for producing a cured product of a heat-curable maleimide resin composition containing:
(A) a maleimide compound having at least one dimer acid frame-derived hydrocarbon group per molecule; and
(B) a radical polymerization initiator,
wherein the method comprises:
a laminating step of obtaining a laminate by laminating a release sheet, a resin layer made of the heat-curable maleimide resin composition, and a base material, in such order; and
a curing step of heating the laminate to a temperature at which the heat-curable maleimide resin composition of the resin layer cures, without removing the release sheet of the laminate.