US 12,264,269 B2
Curable composition, bonded structure, and sealing structure
Katsuhiko Suzuki, Kariya (JP)
Assigned to DENSO CORPORATION, Kariya (JP)
Filed by DENSO CORPORATION, Kariya (JP)
Filed on Jul. 31, 2020, as Appl. No. 16/944,195.
Claims priority of application No. 2019-141351 (JP), filed on Jul. 31, 2019.
Prior Publication US 2021/0032518 A1, Feb. 4, 2021
Int. Cl. C09J 183/04 (2006.01); C08K 9/10 (2006.01); C09J 11/08 (2006.01)
CPC C09J 183/04 (2013.01) [C09J 11/08 (2013.01); C08K 9/10 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A curable composition comprising:
a liquid first agent; and
microcapsules dispersed in the first agent, wherein
each of the microcapsules includes a coating film and a liquid second agent encapsulated inside the coating film,
a strength of each of the microcapsules is greater than or equal to 0.35 Newtons and less than or equal to 10 Newtons,
an average diameter of the microcapsules is greater than or equal to 0.2 millimeters and less than or equal to 0.5 millimeters,
the curable composition is configured to be cured by contact between the first agent and the second agent, and
a mass of the coating film is equal to or greater than 7 mass % and equal to or less than 15 mass % of a mass of the microcapsule.