US 12,264,268 B2
Optically clear adhesives using semi- interpenetrating polymer networks
Radu Reit, Carrollton, TX (US); Jesus Espinoza Diaz, Dallas, TX (US); Adrian Avendano-Bolivar, Plano, TX (US); Apostolos Voutsas, Dallas, TX (US); and David Arreaga-Salas, Garland, TX (US)
Assigned to Ares Materials Inc., Dallas, TX (US)
Appl. No. 16/756,081
Filed by Ares Materials Inc., Dallas, TX (US)
PCT Filed Oct. 17, 2017, PCT No. PCT/US2017/057028
§ 371(c)(1), (2) Date Apr. 14, 2020,
PCT Pub. No. WO2019/078829, PCT Pub. Date Apr. 25, 2019.
Prior Publication US 2020/0255709 A1, Aug. 13, 2020
Int. Cl. B05D 5/10 (2006.01); B05D 5/00 (2006.01); B32B 7/12 (2006.01); C09D 4/00 (2006.01); C09J 5/06 (2006.01); C09J 181/04 (2006.01)
CPC C09J 181/04 (2013.01) [B05D 5/00 (2013.01); B05D 5/10 (2013.01); B32B 7/12 (2013.01); C09D 4/00 (2013.01); C09J 5/06 (2013.01); B05D 2203/00 (2013.01); B32B 2457/20 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A method of manufacturing a semi-interpenetrating optically clear adhesive comprising:
providing a monomer mixture comprising thermoplastic-forming monomers and thermoset-forming monomers, the thermoset-forming monomers comprising one or more multifunctional thiol(s) and one or more multifunctional comonomer(s), the one or more multifun-ctional thiol(s) and the one or more mult fun ctional comonomen(s) provided in off-stoichiometric ratios;
dispensing the monomer mixture on a display module;
curing the thermoset-forming monomers to form a thermoset network of polysulfide thermoset polymers;
curing the thermoplastic-forming monomers to form a thermoplastic network;
wherein the curing the thermoplastic-forming monomers is performed after the curing of the thermoset-forming monomers;
wherein the thermoplastic network semi-interpenetrates the thermoset network to produce the semi-interpenetrating optically clear adhesive
where the optically clear adhesive comprises a Young's Modulus less than 100 MPa in order to serve as a buffer layer for mechanical stresses between two layers of the display module.