	US 12,264,249 B2
	Curable composition for inkjet, cured product and flexible printed circuit board
Bo-Hung Lai, Tainan (TW); Yu-Chiao Shih, Tainan (TW); and Tang-Chieh Huang, Tainan (TW)
Assigned to Microcosm Technology Co., Ltd., Tainan (TW)
Appl. No. 17/798,314
Filed by Microcosm Technology Co., Ltd., Tainan (TW)
PCT Filed Oct. 20, 2020, PCT No. PCT/CN2020/122151 § 371(c)(1), (2) Date Aug. 9, 2022, PCT Pub. No. WO2022/082425, PCT Pub. Date Apr. 28, 2022.
Prior Publication US 2023/0091093 A1, Mar. 23, 2023
Int. Cl. C09D 11/101 (2014.01); B41J 2/01 (2006.01); C09D 11/102 (2014.01); C09D 11/30 (2014.01); C09D 11/38 (2014.01); C09D 11/52 (2014.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01)

CPC C09D 11/101 (2013.01) [B41J 2/01 (2013.01); C09D 11/102 (2013.01); C09D 11/30 (2013.01); C09D 11/38 (2013.01); C09D 11/52 (2013.01); H05K 1/0393 (2013.01); H05K 1/092 (2013.01)]

10 Claims

1. A curable composition for inkjet, comprising:

a soluble polyimide resin;

a photocurable acrylate compound comprising a difunctional (meth)acrylate compound containing an alkylene chain or an alkoxy chain, a bisphenol epoxy (meth)acrylate compound, and a (meth)acrylate compound having a hydroxyl group;

a photopolymerization initiator; and

a thermosetting resin,

wherein the soluble polyimide resin is dissolved in a difunctional (meth)acrylate compound containing the alkylene chain or the alkoxy chain,

wherein a solid content of the soluble polyimide resin dissolved in the difunctional (meth)acrylate compound containing the alkylene chain or the alkoxy chain accounts for 1 wt % to 40 wt % of the difunctional (meth)acrylate compound containing the alkylene chain or the alkoxy chain.