US 12,264,242 B2
Resin composition for optical communication component and optical communication component using the resin composition
Takahito Otomitsu, Tokyo (JP)
Assigned to Fujikura Ltd., Tokyo (JP)
Appl. No. 17/613,997
Filed by Fujikura Ltd., Tokyo (JP)
PCT Filed Jul. 31, 2020, PCT No. PCT/JP2020/029391
§ 371(c)(1), (2) Date Nov. 24, 2021,
PCT Pub. No. WO2021/024932, PCT Pub. Date Feb. 11, 2021.
Claims priority of application No. 2019-145155 (JP), filed on Aug. 7, 2019.
Prior Publication US 2022/0220297 A1, Jul. 14, 2022
Int. Cl. C08L 61/16 (2006.01); C08K 3/36 (2006.01); C08L 71/00 (2006.01); C08L 81/02 (2006.01); C08L 81/06 (2006.01); G02B 6/38 (2006.01); G02B 6/40 (2006.01)
CPC C08L 61/16 (2013.01) [C08K 3/36 (2013.01); C08L 71/00 (2013.01); C08L 81/02 (2013.01); C08L 81/06 (2013.01); C08G 2650/40 (2013.01); C08L 2203/20 (2013.01); G02B 6/3873 (2013.01); G02B 6/403 (2013.01)] 3 Claims
 
1. A resin composition for an optical communication component comprising:
a base resin containing a polyether ether ketone resin as a main component; and
amorphous silica, wherein
a content of the amorphous silica in the resin composition is 55 to 75 mass %,
a circularity of the amorphous silica is 0.80 or more,
the base resin contains a polyphenylene sulfide resin of 2 mass % or more and 20 mass % or less,
a content of the base resin in the resin composition for the optical communication component is 25 to 45 mass %,
the polyphenylene sulfide resin contains a repeating unit of phenylene sulfide in an amount of 80 mol % or more, and
the base resin further contains at least one type of resin selected from a group consisting of a liquid crystalline resin having a melting point of 300° C. or higher, a polyarylene sulfide resin, a polyethersulfone resin, and a polyetherimide resin.