	US 12,264,224 B2
	Maleimide resin composition, prepreg, laminated board, resin film, multilayer printed wiring board, and semiconductor package
Aya Kasahara, Chiyoda-ku (JP); Tomohiko Kotake, Chiyoda-ku (JP); and Daisuke Fujimoto, Chiyoda-ku (JP)
Assigned to RESONAC CORPORATION, Tokyo (JP)
Appl. No. 17/621,498
Filed by Showa Denko Materials Co., Ltd., Chiyoda-ku (JP)
PCT Filed Jun. 25, 2020, PCT No. PCT/JP2020/025028 § 371(c)(1), (2) Date Dec. 21, 2021, PCT Pub. No. WO2020/262537, PCT Pub. Date Dec. 30, 2020.
Claims priority of application No. 2019-117606 (JP), filed on Jun. 25, 2019.
Prior Publication US 2022/0363850 A1, Nov. 17, 2022
Int. Cl. C08J 5/24 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); C08C 19/22 (2006.01); C08F 222/40 (2006.01); C08F 279/02 (2006.01); C08F 285/00 (2006.01); C08J 5/18 (2006.01); C08L 51/04 (2006.01)

CPC C08J 5/24 (2013.01) [B32B 15/14 (2013.01); B32B 15/20 (2013.01); C08C 19/22 (2013.01); C08F 222/40 (2013.01); C08F 279/02 (2013.01); C08F 285/00 (2013.01); C08J 5/18 (2013.01); C08L 51/04 (2013.01); C08J 2447/00 (2013.01); C08J 2453/02 (2013.01); C08L 2203/20 (2013.01); H05K 2201/0145 (2013.01)]

19 Claims

1. A maleimide resin composition comprising

(A) at least one selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a polyaminobismaleimide compound having a structural unit derived from the maleimide compound and a structural unit derived from a diamine compound; and

(B) a modified conjugated diene polymer,

the component (B) being one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups,

wherein a content ratio the component (A) to the component (B) [(A)/(B)] is 2.2 to 5.0 on a mass basis.