US 12,263,634 B2
Substrate processing method, substrate holding apparatus, molding apparatus, and article manufacturing method
Hiroshi Sato, Tochigi (JP)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Aug. 23, 2021, as Appl. No. 17/409,241.
Claims priority of application No. 2020-143389 (JP), filed on Aug. 27, 2020.
Prior Publication US 2022/0063175 A1, Mar. 3, 2022
Int. Cl. B29C 59/00 (2006.01); B29C 59/02 (2006.01); G03F 7/00 (2006.01); H01L 21/56 (2006.01)
CPC B29C 59/002 (2013.01) [B29C 59/022 (2013.01); B29C 59/026 (2013.01); G03F 7/0002 (2013.01); H01L 21/565 (2013.01)] 16 Claims
OG exemplary drawing
 
14. A substrate conveyance apparatus to convey a substrate, the substrate conveyance apparatus comprising:
a substrate holding unit configured to hold the substrate; and
a cover disposed proximal to the upper surface of the substrate,
wherein a space between the upper surface of the substrate and a bottom surface of the cover is narrower than or equal to 2 mm.