US 12,263,574 B2
Manipulator
Hao Guo, Beijing (CN)
Assigned to BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD., Beijing (CN)
Appl. No. 18/044,866
Filed by BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD., Beijing (CN)
PCT Filed Aug. 30, 2021, PCT No. PCT/CN2021/115292
§ 371(c)(1), (2) Date Mar. 10, 2023,
PCT Pub. No. WO2022/052827, PCT Pub. Date Mar. 17, 2022.
Claims priority of application No. 202010952374.9 (CN), filed on Sep. 11, 2020.
Prior Publication US 2023/0330864 A1, Oct. 19, 2023
Int. Cl. B25J 11/00 (2006.01); B25J 15/00 (2006.01); H01L 21/687 (2006.01)
CPC B25J 11/0095 (2013.01) [B25J 15/0014 (2013.01); H01L 21/68707 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A manipulator configured to transfer a wafer comprising:
a finger structure; and
a plurality of support members arranged at the finger structure and distributed at intervals on a same circumference, each support member being configured to contact an edge of the wafer to support the wafer to prevent the wafer from contacting the finger structure;
wherein:
each support member includes a support surface for supporting the wafer;
the support surface is an inclined surface inclined relative to a horizontal plane;
each support member includes:
a support body; and
an anti-slip flexible member arranged at the support body, the support surface being formed over the anti-slip flexible member;.