US 12,263,553 B2
Grinding method for workpiece and grinding apparatus
Keisuke Yamamoto, Tokyo (JP)
Assigned to DISCO CORPORATION, Tokyo (JP)
Filed by DISCO CORPORATION, Tokyo (JP)
Filed on Dec. 1, 2021, as Appl. No. 17/457,090.
Prior Publication US 2022/0088742 A1, Mar. 24, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. B24B 37/10 (2012.01); B24B 7/22 (2006.01); B24B 19/02 (2006.01); B24B 37/005 (2012.01); B24B 37/04 (2012.01); B24B 41/047 (2006.01); B24B 41/053 (2006.01)
CPC B24B 19/02 (2013.01) [B24B 7/228 (2013.01); B24B 37/005 (2013.01); B24B 37/042 (2013.01); B24B 37/10 (2013.01); B24B 41/047 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A grinding method for a workpiece for grinding the workpiece by a grinding apparatus including a holding table that holds the workpiece by a holding surface, and a grinding unit that grinds the workpiece held by the holding table by a grinding wheel having a plurality of grindstones arranged in an annular pattern, the grinding method comprising:
a groove forming step of grinding the workpiece by bringing the grindstones into contact with the workpiece, in a state in which the holding table is not rotated and the grinding wheel is rotated, to form the workpiece with an arcuate groove having a depth of less than a finished thickness of the workpiece; and
a grinding step of bringing the grindstones into contact with a surface side of the workpiece where the groove is formed, in a state in which the holding table and the grinding wheel are rotated, to grind the workpiece until the thickness of the workpiece becomes the finished thickness.