US 12,263,547 B2
Computerized demanufacturing system
Ranganathan Srikanth, Redmond, WA (US); Gregory Lee Weber, Sammamish, WA (US); and Michael Warren Ellis, Woodinville, WA (US)
Assigned to Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed by Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed on Jun. 19, 2023, as Appl. No. 18/337,229.
Claims priority of provisional application 63/503,661, filed on May 22, 2023.
Prior Publication US 2024/0391038 A1, Nov. 28, 2024
Int. Cl. B23P 19/04 (2006.01); B25J 9/00 (2006.01); B25J 11/00 (2006.01); G05B 15/02 (2006.01)
CPC B23P 19/04 (2013.01) [B25J 9/0084 (2013.01); B25J 11/005 (2013.01); G05B 15/02 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for automated device disassembly, comprising:
at a computerized demanufacturing system, receiving a target electronic device for disassembly;
using one or more sensors of the computerized demanufacturing system, collecting a set of sensor data quantifying one or more physical properties of the target electronic device;
based at last in part on the set of sensor data, identifying correspondences between one or more effectors of the computerized demanufacturing system and one or more interactable elements of the target electronic device; and
automatically manipulating the one or more interactable elements of the target electronic device using the one or more effectors of the computerized demanufacturing system to at least partially disassemble the target electronic device through a disassembly sequence of one or more disassembly steps, wherein the disassembly sequence is generated based at least in part on the sensor data and a prior disassembly sequence used to successfully disassemble a prior electronic device, and wherein the prior electronic device shares a common device category with the target electronic device.