US 12,263,530 B2
Cutting tool
Haruyo Fukui, Osaka (JP); Nozomi Tsukihara, Osaka (JP); and Toshihiro Tabata, Osaka (JP)
Assigned to SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
Appl. No. 18/568,287
Filed by Sumitomo Electric Industries, Ltd., Osaka (JP)
PCT Filed May 17, 2023, PCT No. PCT/JP2023/018428
§ 371(c)(1), (2) Date Dec. 8, 2023,
PCT Pub. No. WO2024/236767, PCT Pub. Date Nov. 21, 2024.
Prior Publication US 2024/0383043 A1, Nov. 21, 2024
Int. Cl. B23B 27/14 (2006.01); B23C 5/16 (2006.01); C23C 14/06 (2006.01)
CPC B23B 27/148 (2013.01) [B23B 2224/24 (2013.01); B23B 2228/105 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A cutting tool, comprising:
a base; and
a coating disposed on the base, wherein
the coating includes a first A layer,
the first A layer is composed of an alternate layer in which a first unit layer and a third unit layer are alternately stacked, the alternate layer including 4 to 800 of the first unit layers and 4 to 800 of the third unit layers,
the first unit layer has a hexagonal crystal structure,
the first unit layer is composed of W(C1-aNa)x,
a represents 0.3 or more and 0.8 or less,
x represents 0.8 or more and 1.2 or less,
the third unit layer is composed of AldTi1-d-eMeN,
M represents silicon, boron, yttrium, cerium, or lanthanum,
d represents 0.30 or more and 0.75 or less, and
e represents more than 0 and 0.05 or less.