US 12,263,523 B2
Method for producing bonding composition
Kei Anai, Ageo (JP); Shinichi Yamauchi, Ageo (JP); and Jung-Lae Jo, Ageo (JP)
Assigned to Mitsui Mining & Smelting Co., Ltd., (JP)
Appl. No. 17/910,925
Filed by Mitsui Mining & Smelting Co., Ltd., Tokyo (JP)
PCT Filed Mar. 12, 2021, PCT No. PCT/JP2021/010064
§ 371(c)(1), (2) Date Sep. 12, 2022,
PCT Pub. No. WO2021/193144, PCT Pub. Date Sep. 30, 2021.
Claims priority of application No. 2020-058512 (JP), filed on Mar. 27, 2020.
Prior Publication US 2023/0137716 A1, May 4, 2023
Int. Cl. B22F 1/00 (2022.01); B22F 1/054 (2022.01); B22F 1/107 (2022.01); B22F 9/24 (2006.01); H01B 1/02 (2006.01)
CPC B22F 1/00 (2013.01) [B22F 1/056 (2022.01); B22F 1/107 (2022.01); B22F 9/24 (2013.01); H01B 1/02 (2013.01); B22F 2301/10 (2013.01); B22F 2304/056 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A method for producing a bonding composition, comprising:
producing copper particles in a first liquid medium using a wet reduction method, thereby preparing a dispersion of the copper particles; and
ultimately, finally or eventually replacing the first liquid medium in the dispersion with a second liquid medium while keeping the dispersion wet, thereby obtaining a bonding composition containing the copper particles and the second liquid medium,
wherein the method is performed in the absence of an organic polymer.