US 12,263,507 B2
Integration techniques for micromachined pMUT arrays and electronics using thermocompression bonding, eutectic bonding, and solder bonding
Brian Bircumshaw, Oakland, CA (US); and Sandeep Akkaraju, Wellesley, MA (US)
Assigned to Exo Imaging, Inc., Santa Clara, CA (US)
Filed by eXo Imaging, Inc., Redwood City, CA (US)
Filed on Nov. 11, 2020, as Appl. No. 17/095,333.
Application 17/095,333 is a continuation of application No. PCT/US2019/032062, filed on May 13, 2019.
Claims priority of provisional application 62/671,361, filed on May 14, 2018.
Prior Publication US 2021/0086231 A1, Mar. 25, 2021
Int. Cl. B06B 1/00 (2006.01); B06B 1/06 (2006.01); G01S 7/52 (2006.01); G01S 15/89 (2006.01); H10N 30/073 (2023.01); H10N 30/088 (2023.01); H10N 30/80 (2023.01); H10N 30/853 (2023.01); H10N 30/87 (2023.01)
CPC B06B 1/0622 (2013.01) [G01S 7/52019 (2013.01); G01S 7/52023 (2013.01); G01S 15/8906 (2013.01); H10N 30/073 (2023.02); H10N 30/088 (2023.02); H10N 30/802 (2023.02); H10N 30/8554 (2023.02); H10N 30/875 (2023.02); H10N 30/877 (2023.02); B06B 2201/76 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device comprising a first substrate and a second substrate, the first substrate comprising at least one piezoelectric micromachined ultrasonic transducer (pMUT) array having a plurality of pMUTs, the second substrate comprising a plurality of electrical circuits, wherein the first substrate and the second substrate are bonded together using thermocompression to form individual electrical connections on a one-to-one basis between each of the plurality of pMUTs of the first substrate and a respective one of the plurality of electrical circuits of the second substrate, wherein the individual electrical connections enable each pMUT to be individually addressable by the respective electrical circuit for facilitating control over each pMUT of the at least one pMUT array.