US 12,263,484 B2
Microfluidic devices
Viktor Shkolnikov, Palo Alto, CA (US); Michael W. Cumbie, Corvallis, OR (US); and Chien-Hua Chen, Corvallis, OR (US)
Assigned to Hewlett-Packard Development Company, L.P., Spring, TX (US)
Filed by Hewlett-Packard Development Company, L.P., Spring, TX (US)
Filed on Jan. 27, 2023, as Appl. No. 18/102,412.
Application 18/102,412 is a continuation of application No. 16/605,675, granted, now 11,583,861, previously published as PCT/US2017/059118, filed on Oct. 30, 2017.
Prior Publication US 2023/0173495 A1, Jun. 8, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. B01L 3/00 (2006.01)
CPC B01L 3/523 (2013.01) [B01L 3/502715 (2013.01); B01L 2200/027 (2013.01); B01L 2200/16 (2013.01); B01L 2300/041 (2013.01); B01L 2300/12 (2013.01); B01L 2300/16 (2013.01); B01L 2300/168 (2013.01); B01L 2300/1805 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system comprising:
a blister pack comprising a blister cavity to store a reagent; and
an electrically conductive membrane barrier that releases the reagent from the blister cavity upon application of an electric current to the membrane barrier, the membrane barrier comprising:
a thinned region to generate heat and melt when restricting electric current flow of the electric current through the membrane barrier;
a remaining portion that remains when the reagent is released from the blister cavity upon application of the electric current to the membrane barrier; and
a separable gate section defined by the thinned region and separable from the remaining portion of the membrane barrier at the thinned region when the thinned region melts.