CPC B01F 33/811 (2022.01) [B01F 23/232 (2022.01); B01F 35/2132 (2022.01); B01F 35/71805 (2022.01); B01F 2101/2204 (2022.01)] | 17 Claims |
1. A chemical solution preparation system, wherein
the chemical solution preparation system is disposed inside a chemical mechanical polishing device, and comprises:
a first mixing system, configured to mix a first chemical solution and a first diluent according to a first preset ratio to obtain a first mixture;
a second mixing system, configured to mix a second chemical solution and a second diluent according to a second preset ratio to obtain a second mixture;
a third mixing system, connected to the first mixing system and the second mixing system, respectively, wherein the third mixing system is configured to mix the first mixture, the second mixture, and a third diluent according to a third preset ratio to obtain a third mixture;
an output system, configured to output the third mixture to a spray apparatus of the chemical mechanical polishing device;
a sampling system, configured to collect a sample of the third mixture output from the output system, wherein the sampling system is a branch system communicated with the output system; and
a monitoring system, configured to monitor a status of the first mixture, a status of the second mixture, and a status of the third mixture, wherein the monitoring system comprises a concentration monitoring unit disposed on the branch system, and one end of the concentration monitoring unit communicated with the output system, and the other end communicated with the sampling system.
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