US 12,263,455 B2
High-pressure fluid processing device configured for batch processing
Michael P. Ratigan, Scituate, RI (US); David G. Harney, Stoneham, MA (US); and John Michael Bernard, Stoughton, MA (US)
Assigned to IDEX MPT INC., Westwood, MA (US)
Filed by MICROFLUIDICS INTERNATIONAL CORPORATION, Westwood, MA (US)
Filed on Jun. 16, 2023, as Appl. No. 18/210,952.
Application 18/210,952 is a continuation of application No. 17/188,345, filed on Mar. 1, 2021, granted, now 11,679,363.
Application 17/188,345 is a continuation of application No. 15/457,117, filed on Mar. 13, 2017, granted, now 10,933,428, issued on Mar. 2, 2021.
Claims priority of provisional application 62/307,838, filed on Mar. 14, 2016.
Prior Publication US 2023/0321616 A1, Oct. 12, 2023
Int. Cl. B01F 33/83 (2022.01); B01F 25/50 (2022.01); B01F 35/21 (2022.01); B01F 35/22 (2022.01); B02C 23/18 (2006.01); B02C 23/22 (2006.01); B02C 23/36 (2006.01); B02C 25/00 (2006.01); F04B 15/02 (2006.01); F04B 49/08 (2006.01); F04B 49/22 (2006.01); B01F 33/80 (2022.01); F04B 9/10 (2006.01); F04B 17/03 (2006.01); F04B 43/04 (2006.01); F04B 43/06 (2006.01); F04B 43/12 (2006.01); F04B 43/14 (2006.01)
CPC B01F 25/50 (2022.01) [B01F 33/83 (2022.01); B01F 35/2113 (2022.01); B01F 35/2115 (2022.01); B01F 35/2209 (2022.01); B02C 23/18 (2013.01); B02C 23/22 (2013.01); B02C 23/36 (2013.01); B02C 25/00 (2013.01); F04B 15/02 (2013.01); F04B 49/08 (2013.01); F04B 49/22 (2013.01); B01F 33/8361 (2022.01); F04B 9/10 (2013.01); F04B 17/03 (2013.01); F04B 43/04 (2013.01); F04B 43/06 (2013.01); F04B 43/1238 (2013.01); F04B 43/14 (2013.01); F04B 2205/09 (2013.01); F04B 2205/10 (2013.01); F04B 2205/11 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A high pressure processing device comprising:
a processing module having a flow path with a geometry configured to convert a high pressure to shear or impact forces on a material passing through the processing module;
a pump configured to pump the material to an inlet of the processing module at the high pressure, the high pressure being between 5000 and 45000 psi;
a recirculation pathway configured to recirculate the material from an outlet of the processing module back to the pump;
an user interface including an input device configured to receive a user input indicating a quantity of passes for the material to make through the processing module; and
a controller including a processor and memory, the controller configured to (i) determine a number of pump strokes for the pump based on the user input and (ii) control the pump according to the determined number of pump strokes so that the material makes the quantity of passes through the processing module.