US 11,943,966 B2
Display device
Sungjae Moon, Yongin-si (KR); Dongwoo Kim, Yongin-si (KR); Junhyun Park, Yongin-si (KR); and Kangmoon Jo, Yongin-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed by SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed on Mar. 8, 2022, as Appl. No. 17/653,895.
Application 17/653,895 is a division of application No. 16/793,394, filed on Feb. 18, 2020, granted, now 11,283,054.
Claims priority of application No. 10-2019-0028856 (KR), filed on Mar. 13, 2019.
Prior Publication US 2022/0199960 A1, Jun. 23, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H10K 50/86 (2023.01); H10K 50/842 (2023.01); H10K 50/844 (2023.01); H10K 59/122 (2023.01); H10K 59/131 (2023.01); H10K 59/38 (2023.01); H10K 59/40 (2023.01)
CPC H10K 50/865 (2023.02) [H10K 50/8426 (2023.02); H10K 50/844 (2023.02); H10K 59/122 (2023.02); H10K 59/1315 (2023.02); H10K 59/38 (2023.02); H10K 59/40 (2023.02)] 9 Claims
OG exemplary drawing
 
1. A display device comprising:
a first substrate including a display area and a peripheral area outside the display area;
a plurality of organic light-emitting diodes in the display area, each of the plurality of organic light-emitting diodes including a pixel electrode, an intermediate layer, and an opposite electrode;
a thin-film encapsulation layer covering the plurality of organic light- emitting diodes and including a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer that are sequentially stacked;
a buffer layer arranged on the thin-film encapsulation layer and covering the display area and the peripheral area;
a pattern layer on the buffer layer, the pattern layer including a first light- blocking pattern shielding a portion of an area between two adjacent organic light-emitting diodes of the plurality of organic light-emitting diodes and
a terminal arranged in the peripheral area and a connection wiring arranged below the terminal, wherein the buffer layer directly contacts a portion of the terminal, and the buffer layer includes
a first contact hole that exposes the terminal and a width of the terminal is greater than a width of the connection wiring.