US 11,943,875 B2
Circuit board with anti-corrosion properties, method for manufacturing the same, and electronic device having the same
Li-Ping Wang, Foshan (CN); Yung-Ping Lin, New Taipei (TW); Yong-Kang Zhang, Foshan (CN); Qiu-Ri Zhang, New Taipei (TW); and You-Zhi Lu, Foshan (CN)
Assigned to CHAMP TECH OPTICAL (FOSHAN) CORPORATION, Foshan (CN)
Filed by CHAMP TECH OPTICAL (FOSHAN) CORPORATION, Foshan (CN)
Filed on May 10, 2022, as Appl. No. 17/740,975.
Claims priority of application No. 202110711063.8 (CN), filed on Jun. 25, 2021.
Prior Publication US 2022/0418114 A1, Dec. 29, 2022
Int. Cl. H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01); H05K 3/28 (2006.01)
CPC H05K 3/282 (2013.01) [H05K 3/0091 (2013.01); H05K 3/103 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A method of manufacturing a circuit board, the method comprising:
providing a circuit substrate, the circuit board comprising a base layer and an outer wiring layer formed on the base layer, and a via hole defined on the circuit substrate and connected to the outer wiring layer;
forming a first protective layer on the outer wiring layer and on an inner sidewall of the via hole by silk-screen printing and forming a mark on the circuit substrate through the silk-screen printing, the first protective layer and the mark being made of a white oil and formed by a same silk-screen printing process; and
forming a second protective layer on the first protective layer, thereby obtaining the circuit board.