CPC H04N 23/555 (2023.01) [H04N 23/55 (2023.01); H04N 23/56 (2023.01); H04N 23/57 (2023.01)] | 17 Claims |
1. An electronic camera assembly comprising:
a camera chip cube bonded to camera bondpads on a first surface of an interposer;
at least one light-emitting diode (LED) bonded to LED bondpads of the interposer at a same height as the camera bondpads; and
a housing extending from the interposer and LEDs to a height of the camera chip cube, light guides extending through the housing from the LEDs to a top of the housing;
the interposer having a cable coupled to bondpads on a second surface of the interposer, the second surface of the interposer being opposite the first surface of the interposer;
wherein the light guides are formed between a reflective inner surface of a cavity of the housing and a reflective outer surface of the camera chip cube.
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