US 11,942,676 B2
Single-package wireless communication device
Mohamed A. Megahed, Gilbert, AZ (US)
Assigned to Tahoe Research, Ltd., Dublin (IE)
Filed by Tahoe Research, Ltd., Dublin (IE)
Filed on Jan. 9, 2023, as Appl. No. 18/151,657.
Application 18/151,657 is a division of application No. 16/940,103, filed on Jul. 27, 2020, granted, now 11,552,383, issued on Jan. 10, 2023.
Application 13/371,663 is a division of application No. 12/714,718, filed on Mar. 1, 2010, granted, now 8,138,599, issued on Mar. 20, 2012.
Application 12/714,718 is a division of application No. 11/394,831, filed on Mar. 31, 2006, granted, now 7,692,295, issued on Apr. 6, 2010.
Application 16/940,103 is a continuation of application No. 16/594,889, filed on Oct. 7, 2019, granted, now 10,727,567, issued on Oct. 8, 2019.
Application 16/594,889 is a continuation of application No. 15/360,478, filed on Nov. 23, 2016, granted, now 10,439,265, issued on Oct. 8, 2019.
Application 15/360,478 is a continuation of application No. 13/371,663, filed on Feb. 13, 2012, abandoned.
Prior Publication US 2023/0163444 A1, May 25, 2023
Int. Cl. H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/66 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 25/16 (2023.01); H01Q 1/22 (2006.01); H01Q 1/38 (2006.01); H01Q 1/48 (2006.01)
CPC H01Q 1/2291 (2013.01) [H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H01Q 1/38 (2013.01); H01Q 1/48 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system-in-package transceiver comprising:
a single integrated circuit package that includes:
a first die including a front end module for processing radio frequency signals, configured to couple to an antenna;
a second die including a radio frequency integrated circuit coupled to the front end module and for converting radio frequency signals from the front end module to digital signals; and
a third die including a baseband module coupled to the radio frequency integrated circuit for communicating with an application processor;
wherein the application processor supports at least two standards selected from a group of standards including a personal area network standard, a local area network standard, and a wide area network standard.