US 11,942,464 B2
Semiconductor package and method
Hao-Jan Pei, Hsinchu (TW); Hsiu-Jen Lin, Zhubei (TW); Wei-Yu Chen, Taipei (TW); Philip Yu-Shuan Chung, Taipei (TW); Chia-Shen Cheng, Hsinchu (TW); Kuei-Wei Huang, Hsinchu (TW); Ching-Hua Hsieh, Hsinchu (TW); Chung-Shi Liu, Hsinchu (TW); and Chen-Hua Yu, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jul. 19, 2021, as Appl. No. 17/379,365.
Application 17/379,365 is a continuation of application No. 16/148,465, filed on Oct. 1, 2018, granted, now 11,069,671.
Claims priority of provisional application 62/647,379, filed on Mar. 23, 2018.
Prior Publication US 2021/0351172 A1, Nov. 11, 2021
Int. Cl. H01L 25/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 25/10 (2006.01)
CPC H01L 25/50 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3128 (2013.01); H01L 23/5384 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/96 (2013.01); H01L 25/105 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/211 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
bonding a first package component to a second package component, the first package component comprising first conductive connectors in a first package region and second conductive connectors in a second package region, the first package region adjacent the second package region, the bonding comprising:
projecting a laser beam at a first portion of the first package component until the first conductive connectors reflow, the first portion of the first package component overlapping each of the first conductive connectors and a subset of the second conductive connectors;
turning off the laser beam until the first conductive connectors solidify;
projecting the laser beam at a second portion of the first package component until the second conductive connectors reflow, the second portion of the first package component overlapping each of the second conductive connectors and a subset of the first conductive connectors; and
turning off the laser beam until the second conductive connectors solidify.