US 11,942,459 B2
Semiconductor device package with exposed bond wires
Hua Tan, Shanghai (CN); Hope Chiu, Shanghai (CN); Weiting Jiang, Shanghai (CN); Elley Zhang, Shanghai (CN); Cong Zhang, Shanghai (CN); Simon Dong, Shanghai (CN); Jerry Tang, Shanghai (CN); and Rosy Zhao, Shanghai (CN)
Assigned to Western Digital Technologies, Inc., San Jose, CA (US)
Filed by Western Digital Technologies, Inc., San Jose, CA (US)
Filed on Feb. 14, 2022, as Appl. No. 17/670,763.
Prior Publication US 2023/0260975 A1, Aug. 17, 2023
Int. Cl. H01L 25/10 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 25/105 (2013.01) [H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06586 (2013.01); H01L 2225/1058 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device package comprising:
a first substrate having an electrical circuit;
a plurality of semiconductor dies stacked one on top of the other and positioned above the first substrate;
a plurality of bond wires electrically connected one to another and electrically coupling the plurality of semiconductor dies to one another and to the electrical circuit on the first substrate, the plurality of bond wires including a first bond wire having a first portion connected to a first semiconductor die of the plurality of semiconductor dies, a second portion connected to a second semiconductor die of the plurality of semiconductor dies, and an intermediate portion between the first portion and second portion;
a molding compound encapsulating the plurality of semiconductor dies, the first portion of the first bond wire, and second portion of the first bond wire, wherein the molding compound has top and side planar surfaces, the side planar surface being substantially perpendicular to the top planar surface;
wherein the intermediate portion of the first bond wire is exposed along the top planar surface of the molding compound; and
wherein the intermediate portion of the first bond wire is configured to contact a conductive component.