US 11,942,405 B2
Semiconductor package assembly using a passive device as a standoff
Jianguo Li, Markham (CA); and Roden Topacio, Markham (CA)
Assigned to ATI TECHNOLOGIES ULC, Markham (CA)
Filed by ATI TECHNOLOGIES ULC, Markham (CA)
Filed on Nov. 12, 2021, as Appl. No. 17/525,424.
Prior Publication US 2023/0154834 A1, May 18, 2023
Int. Cl. H01L 25/16 (2023.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01); H01L 23/64 (2006.01)
CPC H01L 23/49816 (2013.01) [H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/642 (2013.01); H01L 23/645 (2013.01); H01L 23/647 (2013.01); H01L 25/16 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A semiconductor package assembly comprising:
a semiconductor package including a semiconductor chip bonded to a substrate;
a plurality of passive devices mounted on a bottom surface of the substrate opposite the semiconductor chip, the plurality of passive devices including a plurality of operable passive devices and a plurality of standoff passive devices, wherein a height of each of the plurality of standoff passive devices is greater than a height of any of the plurality of operable passive devices; and
a plurality of solder structures attached to the bottom surface of the substrate.
 
7. An apparatus comprising:
a circuit board;
a semiconductor package coupled to the circuit board by a plurality of solder structures, the semiconductor package including a semiconductor chip bonded to a substrate; and
a plurality of passive devices mounted on a bottom surface of the substrate between the substrate and the circuit board, the plurality of passive devices including a plurality of operable passive devices and a plurality of standoff passive devices, wherein a height of each of the plurality of standoff passive devices is greater than a height of any of the plurality of operable passive devices.