US 11,942,404 B2
Apparatuses and systems having ball grid arrays and associated microelectronic devices and device packages
Matthew B. Leslie, Boise, ID (US); Timothy M. Hollis, Meridian, ID (US); Scott R. Cyr, Boise, ID (US); Stephen F. Moxham, Boise, ID (US); Matthew A. Prather, Boise, ID (US); and Scott Smith, Plano, TX (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Aug. 25, 2021, as Appl. No. 17/411,879.
Claims priority of provisional application 63/069,865, filed on Aug. 25, 2020.
Prior Publication US 2022/0068778 A1, Mar. 3, 2022
Int. Cl. H01L 23/498 (2006.01); H01L 25/065 (2023.01); H01L 25/10 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01)
CPC H01L 23/49816 (2013.01) [H01L 23/49827 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 23/13 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/48105 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/4824 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/107 (2013.01); H01L 2924/14361 (2013.01)] 21 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a device substrate comprising a semiconductor material and bond pads coupled with an active surface of the device substrate;
a package substrate secured to the device substrate, the package substrate configured to route signals to and from the bond pads; and
a ball grid array supported on, and electrically connected to, the package substrate, the ball grid array comprising an odd number of columns, such that the ball grid array comprises a central column having equal numbers of other columns on opposite sides of the central column;
wherein each ball of the ball grid array positioned and configured to carry a clock signal or a strobe signal is located in the central column of the ball grid, array,
wherein a total number of balls in the ball grid array is between about 115 and about 120.