US 11,942,383 B2
Linear spacer for spacing a carrier of a package
Edward Fuergut, Dasing (DE); Chii Shang Hong, Melaka (MY); Teck Sim Lee, Melaka (MY); Ralf Otremba, Kaufbeuren (DE); Daniel Pedone, Munich (DE); and Bernd Schmoelzer, Radenthein (AT)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Oct. 14, 2021, as Appl. No. 17/501,568.
Claims priority of application No. 10 2020 129 423.9 (DE), filed on Nov. 9, 2020.
Prior Publication US 2022/0148934 A1, May 12, 2022
Int. Cl. H01L 23/16 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01)
CPC H01L 23/16 (2013.01) [H01L 21/4871 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/3672 (2013.01)] 15 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a package for mounting on a mounting base and for being thermally coupled with a heat sink, wherein the package comprises:
a carrier to be thermally coupled with the heat sink;
an electronic component mounted at the carrier;
leads electrically coupled with the electronic component and to be electrically coupled with the mounting base;
an encapsulant encapsulating at least part of the electronic component, at least part of the carrier, and part of the leads;
wherein a main surface of the package is constituted by a planar area defined by material of the encapsulant and by a surface of the carrier;
a linear spacer which protrudes beyond the planar area;
the heat sink mounted on the package so as to be thermally coupled with the carrier; and
the linear spacer defining a spacing between the carrier and the heat sink.