US 11,942,369 B2
Thin semiconductor package for notched semiconductor die
Shutesh Krishnan, Negeri Sembilan (MY); Sw Wei Wang, Seremban (MY); Ch Chew, Seremban (MY); How Kiat Liew, Bukit Jalil (MY); and Fui Fui Tan, Seremban (MY)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed on Jul. 30, 2020, as Appl. No. 16/942,916.
Application 16/942,916 is a division of application No. 16/395,822, filed on Apr. 26, 2019, granted, now 10,763,173.
Application 16/395,822 is a continuation of application No. 15/679,664, filed on Aug. 17, 2017, granted, now 10,319,639, issued on Jun. 11, 2019.
Prior Publication US 2020/0357697 A1, Nov. 12, 2020
Int. Cl. H01L 21/768 (2006.01); H01L 21/306 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/482 (2006.01); H01L 23/495 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 25/065 (2023.01); H01L 29/06 (2006.01)
CPC H01L 21/78 (2013.01) [H01L 21/306 (2013.01); H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 23/3114 (2013.01); H01L 23/482 (2013.01); H01L 29/0657 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
a die comprising a notch located around a perimeter of a sixth side of the die, the die comprising a first side opposing the sixth side, the first side of the die comprising a plurality of electrical contacts;
a second molding compound coupled over the sixth side of the die and into the notch;
a first molding compound coupled over the first side of the die, the first molding compound forming a thickness above the first side; and
a metal layer coupled to the sixth side of the die;
wherein a thickness of the plurality of electrical contacts is substantially the same as the thickness of the first molding compound;
wherein an entirety of the second molding compound is coupled between the metal layer and the die;
wherein each of the metal layer, the second molding compound, and the die all extend to an outermost side surface of the semiconductor package.