US 11,942,249 B2
Composite magnetic particle including metal magnetic particle
Atsushi Tanada, Tokyo (JP)
Assigned to TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed by TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed on Nov. 30, 2022, as Appl. No. 18/071,796.
Application 18/071,796 is a continuation of application No. 16/831,288, filed on Mar. 26, 2020, granted, now 11,538,612.
Claims priority of application No. 2019-062218 (JP), filed on Mar. 28, 2019.
Prior Publication US 2023/0187110 A1, Jun. 15, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01F 17/04 (2006.01); B22F 1/052 (2022.01); B22F 1/102 (2022.01); B22F 1/17 (2022.01); H01F 1/153 (2006.01); H01F 1/24 (2006.01); H01F 1/26 (2006.01); H01F 1/33 (2006.01); H01F 27/255 (2006.01); B22F 1/10 (2022.01)
CPC H01F 17/04 (2013.01) [B22F 1/052 (2022.01); B22F 1/102 (2022.01); B22F 1/17 (2022.01); H01F 1/15375 (2013.01); H01F 1/24 (2013.01); H01F 1/26 (2013.01); H01F 1/33 (2013.01); H01F 27/255 (2013.01); B22F 1/10 (2022.01); H01F 2017/048 (2013.01); Y10T 428/32 (2015.01)] 15 Claims
OG exemplary drawing
 
1. A composite magnetic particle comprising:
a first metal magnetic particle covered with a first resin portion made of a first resin material; and
a second metal magnetic particle having a smaller particle size than the first metal magnetic particle, the second metal magnetic particle being bound to the first metal magnetic particle via a second resin portion made of a second resin material, the second resin material having a softening point higher than the first resin material.