US 11,940,727 B2
Reticle enclosure for lithography systems
Chih-Tsung Shih, Hsinchu (TW); Tsung-Chih Chien, Caotun Township (TW); Tsung Chuan Lee, Taipei (TW); and Hao-Shiang Chang, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD, Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed on Mar. 27, 2023, as Appl. No. 18/126,898.
Application 18/126,898 is a continuation of application No. 17/870,108, filed on Jul. 21, 2022, granted, now 11,614,683, issued on Mar. 28, 2023.
Application 17/870,108 is a continuation of application No. 17/193,236, filed on Mar. 5, 2021, granted, now 11,415,879, issued on Aug. 16, 2022.
Prior Publication US 2023/0236498 A1, Jul. 27, 2023
Int. Cl. G03F 7/20 (2006.01); G03F 1/66 (2012.01); H01L 21/027 (2006.01); H01L 21/673 (2006.01); G03F 7/00 (2006.01)
CPC G03F 1/66 (2013.01) [H01L 21/0274 (2013.01); H01L 21/67359 (2013.01); G03F 7/70741 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A reticle pod, comprising:
an inner pod including an inner base having a first surface, and an inner cover having a second surface and positioned on the inner base with the first surface contacting the second surface, wherein the inner base and the inner cover define a first internal space therebetween;
a plurality of first barriers contacting the first surface and extending between the first surface and second surface; and
a plurality of second barriers contacting the second surface and extending between the first surface and the second surface, the plurality of first barriers and the plurality of second barriers being alternatively arranged in an interlocking pattern about the first internal space.