US 11,940,694 B2
Manufacturing method of light modulation device
Jung Sun You, Daejeon (KR); Dong Hyun Oh, Daejeon (KR); Cheol Min Yun, Daejeon (KR); Jin Hong Kim, Daejeon (KR); Jung Woon Kim, Daejeon (KR); and Min Jun Gim, Daejeon (KR)
Assigned to LG Chem, Ltd., Seoul (KR)
Appl. No. 17/770,203
Filed by LG Chem, Ltd., Seoul (KR)
PCT Filed Nov. 4, 2020, PCT No. PCT/KR2020/015269
§ 371(c)(1), (2) Date Apr. 19, 2022,
PCT Pub. No. WO2021/091207, PCT Pub. Date May 14, 2021.
Claims priority of application No. 10-2019-0139591 (KR), filed on Nov. 4, 2019.
Prior Publication US 2022/0390779 A1, Dec. 8, 2022
Int. Cl. G02F 1/1337 (2006.01); G02F 1/1339 (2006.01)
CPC G02F 1/1337 (2013.01) [G02F 1/13394 (2013.01); G02F 2202/28 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A method for manufacturing a light modulation device, comprising:
laminating a first substrate and a second substrate wherein the first and second substrates are laminated such that their first surfaces face each other;
wherein a pressure-sensitive adhesive layer or adhesive layer is formed on a first surface of the first substrate,
wherein a spacer is formed on a first surface of the second substrate, and
performing heat treatment before, after or during the lamination,
wherein the heat treatment is performed before the lamination is performed on at least the first substrate at a temperature of 80° C. or more,
wherein the lamination of the first and second substrates is performed during the heat treatment is performed at a temperature in a range of more than 50° C. and less than 90° C.,
wherein the heat treatment is performed after the lamination is performed on the first and second substrates at a temperature of 60° C. or more, and
wherein the heat treatment is performed after the pressure-sensitive adhesive layer or adhesive layer is cured.