US 11,940,481 B2
Electrical connection test for unpopulated printed circuit boards
Daniel Luchsinger, Bassersdorf (CH); Stephan Messerli, Schocherswill (CH); Sven Johannsen, Nuerensdorf (CH); and Hans-Peter Klein, Saarbruecken (DE)
Assigned to DYCONEX AG, Bassersdorf (CH)
Appl. No. 17/636,637
Filed by DYCONEX AG, Bassersdorf (CH)
PCT Filed Jul. 22, 2020, PCT No. PCT/EP2020/070639
§ 371(c)(1), (2) Date Feb. 18, 2022,
PCT Pub. No. WO2021/032396, PCT Pub. Date Feb. 25, 2021.
Claims priority of application No. 19192329 (EP), filed on Aug. 19, 2019.
Prior Publication US 2022/0283218 A1, Sep. 8, 2022
Int. Cl. G01R 31/28 (2006.01); H05K 3/34 (2006.01)
CPC G01R 31/2805 (2013.01) [G01R 31/2808 (2013.01); G01R 31/2817 (2013.01); H05K 3/3494 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A test method for an unpopulated printed circuit board comprising the steps of:
a) exposing the unpopulated printed circuit board to temperatures of a reflow soldering process in a range of 200° C. to 250° C., and
b) testing the electrical connections of the unpopulated printed circuit board at a temperature in a range of 100° C. to 120° C.