US 11,940,463 B2
Particle measurement device, three-dimensional shape measurement device, prober device, particle measurement system, and particle measurement method
Natsumi Hayashi, Tsuchiura (JP); Hideki Morii, Tsuchiura (JP); Tetsuo Yoshida, Tokyo (JP); and Toshiyuki Kimura, Tokyo (JP)
Assigned to TOKYO SEIMITSU CO., LTD., Hachioji (JP)
Filed by Tokyo Seimitsu Co., Ltd., Hachioji (JP)
Filed on Aug. 31, 2023, as Appl. No. 18/459,132.
Application 18/459,132 is a continuation of application No. PCT/JP2022/008158, filed on Feb. 28, 2022.
Claims priority of application No. 2021-032413 (JP), filed on Mar. 2, 2021.
Prior Publication US 2023/0417797 A1, Dec. 28, 2023
Int. Cl. G01R 1/067 (2006.01); G01R 1/073 (2006.01)
CPC G01R 1/06711 (2013.01) [G01R 1/07314 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A particle measurement device configured to measure particles generated when a probe needle contacts an electrode pad of a wafer to check electrical characteristics of the wafer, the device comprising:
an acquiring unit configured to acquire pad surface shape data indicating a surface shape of the electrode pad including a probe needle mark where the probe needle has contacted;
a detecting unit configured to detect a pad reference surface as a reference for measurement of the particles from a surface of the electrode pad based on the pad surface shape data acquired by the acquiring unit;
a roughness calculating unit configured to calculate volume of a recessed portion recessed from the pad reference surface in the surface shape of the electrode pad and volume of a protruding portion protruding from the pad reference surface based on the pad surface shape data acquired by the acquiring unit; and
a particle quantity calculating unit configured to calculate a particle quantity from a volume difference between the volume of the recessed portion and the volume of the protruding portion which are calculated by the roughness calculating unit.