US 11,940,340 B2
Integrated sensors
Clark T. Olsen, Dassel, MN (US); and Duane M. Jelkin, Hutchinson, MN (US)
Assigned to Hutchinson Technology Incorporated, Hutchinson, MN (US)
Filed by Hutchinson Technology Incorporated, Hutchinson, MN (US)
Filed on Sep. 22, 2020, as Appl. No. 17/028,706.
Claims priority of provisional application 63/024,455, filed on May 13, 2020.
Prior Publication US 2021/0356338 A1, Nov. 18, 2021
Int. Cl. G01L 1/22 (2006.01); G01K 7/16 (2006.01); G01L 1/14 (2006.01)
CPC G01L 1/2206 (2013.01) [G01K 7/16 (2013.01); G01L 1/14 (2013.01)] 15 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a substrate; and
one or more sensors mounted to the substrate, the one or more sensors is mounted to the substrate using adhesive material and one or more spot welds, wherein the one or more sensors include:
a sensor element, wherein one or more ends of the sensor element terminate at sensor bond pads; and
a series of linear portions each connected at opposite ends and extend in parallel with one another.