US 11,939,665 B2
Film thickness measuring apparatus and film thickness measuring method, and film forming system and film forming method
Masato Shinada, Tokyo (JP); Tamaki Takeyama, Yamanashi (JP); Kazunaga Ono, Yamanashi (JP); Naoyuki Suzuki, Tokyo (JP); Hiroaki Chihaya, Yamanashi (JP); and Einstein Noel Abarra, Tokyo (JP)
Assigned to TOKYO ELECTRON LIMTED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Feb. 24, 2021, as Appl. No. 17/184,089.
Claims priority of application No. 2020-040854 (JP), filed on Mar. 10, 2020; and application No. 2020-184211 (JP), filed on Nov. 4, 2020.
Prior Publication US 2021/0285096 A1, Sep. 16, 2021
Int. Cl. C23C 14/54 (2006.01); G01B 11/06 (2006.01); G01S 7/481 (2006.01); G01S 17/08 (2006.01); H01F 41/32 (2006.01); H01L 21/66 (2006.01); H10N 50/01 (2023.01)
CPC C23C 14/547 (2013.01) [G01B 11/0625 (2013.01); G01S 7/4814 (2013.01); G01S 17/08 (2013.01); H01F 41/32 (2013.01); H01L 22/12 (2013.01); H10N 50/01 (2023.02)] 28 Claims
OG exemplary drawing
 
1. A film thickness measuring apparatus comprising:
a stage configured to place a substrate having a film formed thereon and measure a thickness of the film in-situ in a film forming apparatus, the film forming apparatus including a processing module that forms the film on the substrate and a transfer module that transfers the substrate to the processing module;
a film thickness meter including a light emitter that emits light toward the substrate disposed on the stage and a light receiving sensor that receives the light reflected by the substrate for measuring the thickness of the film in-situ;
a moving mechanism including a multi-joint arm configured to move an irradiation point of the light on the substrate;
a distance meter configured to measure a distance between the light receiving sensor and the irradiation point on the substrate; and
a distance adjustor configured to adjust the distance between the light receiving sensor and the irradiation point on the substrate.