US 11,939,492 B2
Adhesive resin composition, method for bonding adherends, and adhesive resin film
Hirokazu Iizuka, Tokyo (JP); Kunihiro Takei, Tokyo (JP); Yuiko Maruyama, Tokyo (JP); and Yuki Sato, Tokyo (JP)
Assigned to FUJIMORI KOGYO CO., LTD., Tokyo (JP)
Filed by FUJIMORI KOGYO CO., LTD., Tokyo (JP)
Filed on May 13, 2022, as Appl. No. 17/744,191.
Application 17/744,191 is a continuation of application No. 16/074,945, granted, now 11,359,117, previously published as PCT/IB2016/001741, filed on Dec. 12, 2016.
Claims priority of application No. 2016-021940 (JP), filed on Feb. 8, 2016.
Prior Publication US 2022/0275258 A1, Sep. 1, 2022
Int. Cl. C09J 7/20 (2018.01); B32B 37/12 (2006.01); B32B 38/00 (2006.01); C09J 7/30 (2018.01); C09J 123/26 (2006.01); C09J 151/06 (2006.01); C09J 163/04 (2006.01)
CPC C09J 123/26 (2013.01) [B32B 37/12 (2013.01); B32B 38/0036 (2013.01); C09J 7/20 (2018.01); C09J 7/30 (2018.01); C09J 151/06 (2013.01); C09J 163/04 (2013.01); C08L 2201/56 (2013.01); Y10T 428/287 (2015.01)] 3 Claims
 
1. An adhesive resin composition consisting of:
more than 50 parts by mass and 99.5 parts by mass or less in a solid content of an acid-modified polyolefin resin (A) having a melting point of 50 to 100° C.;
0.5 parts by mass or more and less than 50 parts by mass in a solid content of an epoxy resin (B) having a novolac structure; and
an organic solvent (C),
wherein said acid-modified polyolefin resin (A) has a methyl group and an ethyl group on a side chain,
said organic solvent (C) includes toluene and methyl ethyl ketone, and
said epoxy resin (B) having the novolac structure is a bisphenol A novolac epoxy resin represented by formula (1):

OG Complex Work Unit Chemistry
wherein, R1 to R6 each are independently a hydrogen atom or a methyl group, n is an integer of 0 to 10, and RX is a group having an epoxy group, and
R1 to R6 satisfy at least any one of (i) to (iii):
(i) both of R1 and R2 are a methyl group;
(ii) both of R3 and R4 are a methyl group; and
(iii) both of R5 and R6 are a methyl group, and
wherein in dynamic viscoelasticity measurement, an adhesive resin film formed including said adhesive resin composition has a storage modulus value at 60° C. of 1.0×106 to 1.0×108 Pa and a storage modulus value at 150° C. of 1.0×104 to 1.0×108 Pa.