	US 11,939,443 B2
	Polyphenylene ether resin composition, prepreg, metal-clad laminate
Shota Osumi, Chiba (JP); Izumi Tando, Chiba (JP); Hiroki Ueda, Chiba (JP); and Yoshio Hayakawa, Chiba (JP)
Assigned to NIPPON SODA CO., LTD., Tokyo (JP)
Appl. No. 17/632,067
Filed by NIPPON SODA CO., LTD., Tokyo (JP)
PCT Filed Jul. 7, 2020, PCT No. PCT/JP2020/026565 § 371(c)(1), (2) Date Feb. 1, 2022, PCT Pub. No. WO2021/024679, PCT Pub. Date Feb. 11, 2021.
Claims priority of application No. 2019-144191 (JP), filed on Aug. 6, 2019; and application No. 2020-031772 (JP), filed on Feb. 27, 2020.
Prior Publication US 2022/0251376 A1, Aug. 11, 2022
Int. Cl. C08J 5/24 (2006.01); B32B 5/02 (2006.01); B32B 15/12 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); C08L 53/02 (2006.01); C08L 71/12 (2006.01)

CPC C08J 5/244 (2021.05) [B32B 5/02 (2013.01); B32B 5/022 (2013.01); B32B 15/12 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); C08L 53/02 (2013.01); C08L 71/12 (2013.01); B32B 2260/021 (2013.01); B32B 2260/023 (2013.01); B32B 2260/028 (2013.01); B32B 2260/046 (2013.01); B32B 2262/0269 (2013.01); B32B 2262/0276 (2013.01); B32B 2262/101 (2013.01); B32B 2307/204 (2013.01); B32B 2307/306 (2013.01); B32B 2307/308 (2013.01)]

10 Claims

1. A polyphenylene ether resin composition comprising (A) polyphenylene ether, and (B) a styrene-butadiene-styrene block copolymer (SBS) having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure in a butadiene block of 80:20 to 100:0, wherein

a number average molecular weight (Mn) of the component (A) is 1,000 to 5,000, and

a weight average molecular weight (Mw) of the component (B) is 2,000 to 100,000.