US 11,939,439 B2
Composite polyimide film, producing method thereof, and printed circuit board using same
Junseok Lee, Seoul (KR); Dongjoo You, Seoul (KR); Seongmoon Cho, Seoul (KR); Jinkyun Lee, Seoul (KR); and Seungsoo Choi, Seoul (KR)
Assigned to LG ELECTRONICS INC., Seoul (KR)
Filed by LG ELECTRONICS INC., Seoul (KR)
Filed on Nov. 29, 2021, as Appl. No. 17/536,604.
Claims priority of application No. 10-2020-0162598 (KR), filed on Nov. 27, 2020; and application No. 10-2021-0143951 (KR), filed on Oct. 26, 2021.
Prior Publication US 2022/0169807 A1, Jun. 2, 2022
Int. Cl. C08J 5/18 (2006.01); C08K 3/36 (2006.01); C08K 7/26 (2006.01)
CPC C08J 5/18 (2013.01) [C08K 3/36 (2013.01); C08K 7/26 (2013.01); C08J 2327/18 (2013.01); C08J 2379/08 (2013.01); C08K 2201/002 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A composite polyimide film comprising:
a film matrix including polyimide; and
a plurality of filler particles dispersed in the film matrix,
wherein at least one of the plurality of filler particles includes an inorganic particle, and a fluorine polymer coating formed on the inorganic particle,
wherein the inorganic particle includes a silica (SiO2) particle,
wherein the silica particle includes a hollow silica particle or a mesoporous silica particle, and
wherein a thickness of the fluorine polymer coating is in a range of 10 to 60 nm.