US 11,939,270 B2
Production method for copper/ceramic joined body, production method for insulated circuit board, copper/ceramic joined body, and insulated circuit board
Shuji Nishimoto, Saitama (JP); and Satoshi Takakuwa, Saitama (JP)
Assigned to MITSUBISHI MATERIALS CORPORATION, Tokyo (JP)
Appl. No. 17/418,384
Filed by MITSUBISHI MATERIALS CORPORATION, Tokyo (JP)
PCT Filed Feb. 4, 2020, PCT No. PCT/JP2020/004089
§ 371(c)(1), (2) Date Jun. 25, 2021,
PCT Pub. No. WO2020/162445, PCT Pub. Date Aug. 13, 2020.
Claims priority of application No. 2019-017893 (JP), filed on Feb. 4, 2019.
Prior Publication US 2022/0064074 A1, Mar. 3, 2022
Int. Cl. C04B 37/02 (2006.01); B23K 1/19 (2006.01); B32B 15/04 (2006.01); B32B 15/20 (2006.01); C22C 9/00 (2006.01); C22F 1/08 (2006.01); H05K 1/03 (2006.01); B23K 101/42 (2006.01); B23K 103/00 (2006.01); B23K 103/12 (2006.01)
CPC C04B 37/021 (2013.01) [B23K 1/19 (2013.01); B32B 15/04 (2013.01); B32B 15/20 (2013.01); C22C 9/00 (2013.01); C22F 1/08 (2013.01); H05K 1/0306 (2013.01); B23K 2101/42 (2018.08); B23K 2103/12 (2018.08); B23K 2103/52 (2018.08); B32B 2457/08 (2013.01); C04B 2237/407 (2013.01); H05K 2201/0338 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A method of producing a copper/ceramic bonded body with a copper member and a ceramic member bonded each other, the copper member having a composition having a Cu purity of 99.96 mass % or more, a balance of inevitable impurities, a P content of 2 mass ppm or less, and a total content of Pb, Se and Te of 10 mass ppm or less, the method comprises:
a bonding step of bonding the copper member and the ceramic member laminated to each other by pressing the laminated copper member and ceramic member in a laminating direction and heating,
wherein an average crystal grain size of the copper member before bonding is set to 10 μm or more,
an aspect ratio, which means a ratio of a major axis to a minor axis of a crystal grain on a rolled surface, is set to 2 or less, and
in the bonding step, a pressing load in the laminating direction is set to be in a range of 0.05 MPa or more and 1.5 MPa or less, a heating temperature is set to be in a range of 800° C. or higher and 850° C. or lower, and a holding time at the heating temperature is set to be in a range of 10 minutes or longer and 90 minutes or shorter.