US 11,938,708 B1
Fabrication of high-resolution graphene-based flexible electronics via polymer casting
Metin Uz, Ames, IA (US); and Surya Mallapragada, Ames, IA (US)
Assigned to lowa State University Research Foundation, Inc., Ames, IA (US)
Filed by Iowa State University Research Foundation, Inc., Ames, IA (US)
Filed on Aug. 30, 2022, as Appl. No. 17/898,745.
Application 17/898,745 is a division of application No. 16/687,347, filed on Nov. 18, 2019, granted, now 11,465,397.
Application 16/687,347 is a continuation in part of application No. 16/547,239, filed on Aug. 21, 2019, granted, now 11,066,296, issued on Jul. 20, 2021.
Claims priority of provisional application 62/769,387, filed on Nov. 19, 2018.
Claims priority of provisional application 62/720,693, filed on Aug. 21, 2018.
This patent is subject to a terminal disclaimer.
Int. Cl. B32B 37/00 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 3/02 (2006.01)
CPC B32B 37/025 (2013.01) [H05K 1/0277 (2013.01); H05K 1/097 (2013.01); H05K 3/025 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A method of fabrication of high resolution conductive patterns on polymeric substrates comprising:
a. forming a high resolution pattern with 3D features in a starting substrate;
b. forming an end product comprising a combination of a high-resolution conductive pattern based on the high resolution pattern on a polymeric substrate by:
(1) creating a high resolution pattern on the starting substrate filled with a conductive material, coating the patterned conductive material on the starting substrate with a polymeric solution, drying the polymeric solution in a manner effective to promote adherence of the patterned conductive material to the dried polymeric layer, and peeling the dried polymeric layer and adhered conductive material from the starting substrate to transfer the dried conductive material in the high resolution pattern from the starting substrate to the dried polymeric layer.