US 11,938,586 B2
Slurry monitoring device, CMP system and method of in-line monitoring a slurry
Chwen Yu, Taipei (TW); Ting-Wen Chen, Hsinchu (TW); and Chi Wen Kuo, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed on Aug. 27, 2021, as Appl. No. 17/460,046.
Prior Publication US 2023/0060960 A1, Mar. 2, 2023
Int. Cl. B24B 49/12 (2006.01); B24B 57/02 (2006.01); G01N 15/0205 (2024.01)
CPC B24B 49/12 (2013.01) [B24B 57/02 (2013.01); G01N 15/0211 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A slurry monitoring device, comprising:
a slurry metrology cell, configured to accommodating a slurry;
a plurality of light sources configured to emit light beams on the slurry in the slurry metrology cell, wherein the light sources comprise a first light source configured to emit a first light beam having a first wavelength, a second light source configured to emit a second light beam having a second wavelength equal to the first wavelength;
at least one optical chopper disposed between the plurality of light sources and the slurry metrology cell, wherein a quantity of the chopper is less than a quantity of the plurality of light sources; and
at least one optical detector, configured to detect intensities of the light beams scattered by abrasive particles in the slurry,
wherein the first light source emits the first light beam to the slurry metrology cell through the at least one optical chopper, and the second light source emits the second light beam directly to the slurry metrology cell.