US 11,938,524 B2
Substrate processing apparatus and substrate processing method
Jun Nonaka, Kumamoto (JP); and Mitsunori Nakamori, Kumamoto (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Appl. No. 17/442,137
Filed by Tokyo Electron Limited, Tokyo (JP)
PCT Filed Aug. 17, 2020, PCT No. PCT/JP2020/030933
§ 371(c)(1), (2) Date Sep. 23, 2021,
PCT Pub. No. WO2021/039449, PCT Pub. Date Mar. 4, 2021.
Claims priority of application No. 2019-157255 (JP), filed on Aug. 29, 2019.
Prior Publication US 2022/0168785 A1, Jun. 2, 2022
Int. Cl. B08B 3/10 (2006.01)
CPC B08B 3/10 (2013.01) 14 Claims
OG exemplary drawing
 
1. A substrate processing apparatus, comprising
a liquid processing tank that stores a processing liquid and dips a plurality of substrates in the processing liquid to liquid-process the plurality of substrates;
a hydrophobizing gas supplier that supplies a gas of a hydrophobizing agent to the plurality of substrates after the liquid processing; and
a processing liquid supplier that supplies the processing liquid to the liquid processing tank, wherein
the processing liquid supplier includes an organic solvent supplier that supplies an organic solvent to the liquid processing tank,
the processing liquid supplier supplies the organic solvent that is supplied from the organic solvent supplier to the liquid processing tank, and
the liquid processing tank comprises a storage tank, an overflow tank, and a seal tank, the overflow tank is formed on a peripheral part of the storage tank at an upper end of the storage tank, and the seal tank is formed on a peripheral part of the overflow tank at an upper end of the overflow tank.