US 11,938,511 B2
Coating method, coating apparatus and recording medium
Masatoshi Kawakita, Koshi (JP); Yusaku Hashimoto, Koshi (JP); and Kosuke Yoshihara, Koshi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Jun. 30, 2022, as Appl. No. 17/809,947.
Application 17/809,947 is a continuation of application No. 16/869,664, filed on May 8, 2020, granted, now 11,407,005.
Claims priority of application No. 2019-089243 (JP), filed on May 9, 2019.
Prior Publication US 2022/0323990 A1, Oct. 13, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. B05D 1/00 (2006.01); B05C 5/02 (2006.01); B05D 3/10 (2006.01)
CPC B05D 1/005 (2013.01) [B05C 5/02 (2013.01); B05D 3/10 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A coating method, comprising:
supplying a film forming liquid onto a front surface of a substrate from a nozzle in a state that a distance between the front surface of the substrate and a lower end of the nozzle is maintained at a coating distance; and
diffusing the film forming liquid supplied from the nozzle toward an edge of the substrate by rotating the substrate,
wherein the coating distance is larger than a thickness of an outer periphery region of a film of the film forming liquid, the outer periphery region is a region other than directly below the lower end of the nozzle,
wherein the coating distance is set to allow the film forming liquid to stay between a lower end surface of the nozzle and the front surface of the substrate in a state that both the lower end surface of the nozzle and the front surface of the substrate are in contact with the film forming liquid when a discharge of the film forming liquid from the nozzle is stopped.
 
5. A coating method, comprising:
supplying a film forming liquid onto a front surface of a substrate from a nozzle in a state that a distance between the front surface of the substrate and a lower end of the nozzle is maintained at a coating distance;
diffusing the film forming liquid supplied from the nozzle toward an edge of the substrate by rotating the substrate; and
cooling the substrate by supplying a cooling fluid to a rear surface of the substrate in a period during which the film forming liquid is supplied onto the front surface of the substrate from the nozzle and diffused toward the edge.