US 12,262,626 B2
Thermosetting liquid composition for encapsulant in organic light-emitting device
Young Min Cho, Asan-si (KR); Jong Geol Lee, Asan-si (KR); and Myung Sup Jung, Asan-si (KR)
Assigned to INNOX ADVANCED MATERIALS CO., LTD., Asan-si (KR)
Filed by INNOX Advanced Materials Co., Ltd., Asan-si (KR)
Filed on Aug. 5, 2022, as Appl. No. 17/881,685.
Claims priority of application No. 10-2021-0103653 (KR), filed on Aug. 6, 2021.
Prior Publication US 2023/0054116 A1, Feb. 23, 2023
Int. Cl. H10K 85/10 (2023.01); C08G 59/38 (2006.01); C08G 59/50 (2006.01); H10K 50/844 (2023.01)
CPC H10K 85/111 (2023.02) [C08G 59/38 (2013.01); C08G 59/50 (2013.01); H10K 50/844 (2023.02)] 10 Claims
 
1. A thermosetting liquid composition for an encapsulant of an organic light-emitting device, the composition comprising:
a binder material including an aliphatic 4-functionalized epoxy-based compound in an amount of 60 or greater parts by weight and less than 100 parts by weight based on 100 parts by weight of the binder material, and an alicyclic 2-functionalized epoxy-based compound in an amount of more than 0 parts by weight and 40 or smaller parts by weight based on 100 parts by weight of the binder material; and
a cationic thermal-curing initiator;
wherein the aliphatic 4-functionalized epoxy-based compound is pentaerythritol glycidyl ether; and
wherein the alicyclic 2-functionalized epoxy-based compound is bis (3,4-epoxycyclohexylmethyl)adipate.